Anterwell Technology Ltd.
Large Original stock of IC Electronics Components, Transistors, Diodes etc.
High Quality, Reasonable Price, Fast Delivery.
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Output Leakage Current: | 50µA | Output Sustaining Voltage: | 40V |
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Collector Emitter Saturation Voltage: | 0.15 V | Input Low Voltage: | 0.8 V |
Input High Voltage: | 2 V | Input Low Current: | 10 µA |
High Light: | electronic chip board,electronic components ic |
Features
• Independent Over-Current Limiting On Each Output
• Independent Over-Temperature Limiting On Each Output
• Output Drivers Capable of Switching 700mA Load
• Inputs Compatible With TTL or 5V CMOS Logic
• Suitable For Resistive, Lamp or Inductive Loads
• Power-Frame Package Construction For Good Heat
Dissipation
• Operating Temperature Ranges
- CA3262A . . . . . . . . . . . . . . . . . . . . . . . -40℃ to 125℃
- CA3262 . . . . . . . . . . . . . . . . . . . . . . . . . -40℃ to 85℃
Applications System Applications
• Solenoids • Automotive
• Relays • Appliances
• Lamps • Industrial Controls
• Steppers • Robotics
• Small Motors
• Displays
Ordering Information
PART NUMBER | TEMP. RANGE (℃) | PACKAGE | PKG. NO. |
CA3262E | -40 to 85 | 16 Ld PDIP | E16.3 |
CA3262AE | -40 to 125 | 16 Ld PDIP | E16.3 |
CA3262AQ | -40 to 125 | 28 Ld PLCC | N28.45 |
CA3262AM | -40 to 125 | 24 Ld SOIC (W) | M24.3 |
Description
The CA3262 and CA3262A are used to interface low-level
logic to high current loads. Each Power Driver has four
inverting switches consisting of a non-inverting logic input
stage and an inverting low-side driver output stage. All inputs
are 5V TTL/CMOS logic compatible and have a common
Enable input. Each output device has independent current
limiting (ILIM) and thermal limiting (TLIM) for protection from
over-load conditions. Steering diodes connected from each
output (in pairs) to the Clamp pins may be used in
conjunction with external zener diodes to protect the IC
against over-voltage transients that result from inductive load
switching.
To allow for maximum heat transfer from the chip, all ground
pins on the DIP, PLCC and SOIC packages are directly
connected to the mounting pad of the chip. Integral heat
spreading lead frames directly connect the bond pads and
ground leads to conduct heat from the chip junction to the
PC Board for good heat dissipation.
The CA3262 and CA3262A can drive four incandescent
lamp loads without modulating their brilliance when the
“cold” lamps are energized. Outputs may be parallel
connected to drive high current loads. The maximum output
current of each output is determined by the over-current lim-
iting threshold which is typically 1.2A but may be as low as
0.7A.
Pinouts
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